| abstract |
A film deposition method includes placing a substrate in a substrate receiving portion of a table provided in a vacuum chamber; and performing, at least once, a film deposition-alteration step and an alteration step. The film deposition-alteration step includes an adsorption step of allowing a first reaction gas to be adsorbed on an upper surface, a reaction product production step of allowing a second reaction gas and the first reaction gas adsorbed on the upper surface to react each other, thereby producing a reaction product, and an alteration process of allowing the upper surface to be exposed to plasma into which an alteration gas is activated. The first reaction gas is supplied from the first reaction gas supplying portion, the second reaction gas is supplied from the second reaction gas supplying portion, and the alteration is supplied from the plasma. |