http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010103805-A1

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filingDate 2010-03-09^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fbd7daf21a85b603d2a6cfc147d0fa1
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publicationDate 2010-09-16^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2010103805-A1
titleOfInvention Multilayer wiring substrate producing method and multilayer wiring substrate obtained by the same
abstract Disclosed is a multilayer wiring substrate producing method comprised of a process of drilling a prepreg by laser processing to form a via hole; a process of filling the via hole with conductive paste containing resin components and metal powders; and a process of pressing copper foils or copper foil portions of a patterned substrate, which are disposed on the upper and lower portions of the conductive paste. In the multilayer wiring substrate producing method, an alloy-type paste wherein at least a part of the metal powders are melted and the adjacent metal powders are alloyed is used as the conductive paste. In the prepreg, when the storage elastic modulus at an inflection point at which the storage elastic modulus is changed from an increase to a decrease is designated by A, and the storage elastic modulus at an inflection point at which the storage elastic modulus is changed from a decrease to an increase is designated by B in a temperature profile wherein the temperature increases from 60°C to 200°C, the ratio A/B is 10 or more before preliminary heating. The ratio A/B is decreased to less than 10 by preliminary heating before the drilling process, so that the multilayer wiring substrate is excellent in conductivity and stability for a long time.
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