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publicationDate 2016-11-10^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2016178991-A1
titleOfInvention Methods for depositing low k and low wet etch rate dielectric thin films
abstract Methods for the formation of SiCN, SiCO and SiCON films comprising cyclical exposure of a substrate surface to a silicon-containing gas, a carbon-containing gas and a plasma. Some embodiments further comprise the addition of an oxidizing agent prior to at least the plasma exposure.
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