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publicationDate 2002-11-05^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6475706-B1
titleOfInvention Pattern formation method
abstract A resist film is formed by applying, on a semiconductor substrate, a resist material containing a base polymer including polystyrene in which hydroxyl groups are substituted for hydrogen atoms at two or more portions of a benzene ring. The resist film is irradiated with exposing light of a wavelength of a 1 nm through 180 nm band through a mask for pattern exposure, and the resist film is developed after the pattern exposure, thereby forming a resist pattern.
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