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publicationDate 2017-09-12^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9758371-B2
titleOfInvention Encapsulated microelectromechanical structure
abstract A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.
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