Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a4b3fbec4b2ca9303a13095cd2cce7db |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L41-1136 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0315 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0271 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-051 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-031 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00277 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-051 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00269 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-113 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-051 |
filingDate |
2016-08-19^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2017-09-12^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ef1e2a8ed07c956678c8a6f2b53efd0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d7b9a7304df15e058fe6a190142a303 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92cb99bcb2301d61c70b367636240f9b |
publicationDate |
2017-09-12^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9758371-B2 |
titleOfInvention |
Encapsulated microelectromechanical structure |
abstract |
A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate. |
priorityDate |
2006-01-20^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |